We hope to become a leading 5v amplifier board with bluetooth, ble radio module, hc6 bluetooth module manufacturer that is respected by the society, trusted by our customers and partners, proud of our employees and with outstanding core competitiveness.We continue to strengthen the construction of the technological innovation system to ensure the quality and credibility of our hc 02 bluetooth, always taking the requirements of customers at heart to provide them with reliable, high-quality and inexpensive products and services. Many of our company's products are not only recognized by domestic customers for their extremely high cost performance and excellent equipment quality, but are also exported overseas and won unanimous praise from customers in overseas markets. Our company carries forward the enterprise spirit of "integrity, innovation, collaboration, and efficiency", and insists on developing innovative technologies, products, management, and services. While vigorously promoting the quality of products and the internationalization of the market, we strive to build a brand image. We think what our customers think, and we hope to create value for our customers and help them succeed in their business. The company will adhere to the guidance of the theory of socialism with Chinese characteristics in the new era, based on both domestic and foreign markets. We are driven by innovation and lead the industry with technology. Our common values are the culture of continuous creation and development, the culture of development in creation and leap in development. We have long used technological innovation as the core driving force and have formed strategic partnerships with many well-known domestic enterprises.
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Smallest Bluetooth ChipZhexin ZX8271 is a Bluetooth V5.0 High-speed serial port transparent transmission module, it supports BLE Slave and OTA upgrade. Main Features Bluetooth 5.0 BLE Proprietary RF SOC UART programming
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Bluetooth Low Energy Mesh ModuleZX8258 series is a Bluetooth Low Energy Mesh Module developed by Hangzhou Zhexin Communication Technology Co., LTD. As a low-power Bluetooth transparent transmission module, its application scenarios
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Wireless Bluetooth Sig Mesh ModuleZX8258 is a low-power Bluetooth transparent transmission module with Built-in high-performance 32-bit MCU, 512KB Flash and 32/48/64KB SRAM. With Built-in 512K Flash, it supports BLE (Up to Bluetooth
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Zigbee Bluetooth ModuleZX5005 series is a low-power Bluetooth transparent transmission module launched by Hangzhou Zhexin Communication Technology Co., Ltd. It conforms to the low-power Bluetooth 5.3 specification and can
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Bluetooth Mesh Network ModuleZX5005 series is a low-power Bluetooth transparent transmission module launched by Hangzhou Zhexin Communication Technology Co., Ltd. It conforms to the low-power Bluetooth 5.3 specification and can
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Bluetooth Smart BLE ModuleZX5005 series is a low-power Bluetooth transparent transmission module launched by Hangzhou Zhexin Communication Technology Co., Ltd. It conforms to the low-power Bluetooth 5.3 specification and can
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Bluetooth Low Energy ModuleZX0802 is a Bluetooth Low Energy Module. It complies with the Low-power Bluetooth 5.3 specification and can also be used for 2.4G development. It is very small in size and has 10 All function pins at
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BLE 5.3 ModuleZX8271 is a Telink Bluetooth Module supports peripheral mode and integrates high-performance RISC 32bit processor, 512KB Flash and 32KB SRAM. The module with fully certificates which are widely used
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BLE Smart ModuleZhexin ZX0802 is a Bluetooth V5.3 High-speed serial port transparent transmission module, it supports BLE Slave and OTA upgrade. Main Features Bluetooth 5.2 BLE Proprietary RF SOC UART programming
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BLE Mini ModuleZX8271 is a small size Bluetooth Low Energy (BLE) 5.0 module, which integrates high-performance RISC 32bit processor, 512KB Flash and 32KB SRAM and supports up to 3 BLE connections.
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BLE Low Energy ModuleZX0802 is a cost-effective Bluetooth SOC Module, and adopt Telink chipset, it supports UART interface to transfer data at pass-through mode, customers can also configure the Bluetooth module
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Stack Bluetooth ModuleThe Bluetooth low energy chip used by ZX0802 includes a 32-bit MCU, 2.4GHz ISM radio, 128KB Flash and 16KB SRAM, which can provide a maximum power output of 10dBm. The chip's maximum receiving
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