Relying on the advantages of advanced production and processing technology, linking advanced talents and multi-level resources, we create hc05 bluetooth arduino, ble module coding, bluetooth chip and pin comprehensive solutions for customers from all angles from design to implementation. We have a strong technical level and an experienced team to provide our customers with convenient and worry-free services.Our company adheres to the customer-oriented and application-oriented strategy, and continues to focus on development in the field of tg113 bluetooth module. We are enthusiastic to provide you with satisfactory service and look forward to working with you to develop together. We offer customized solutions to meet the unique needs of our clients and their industries. Our employees are respectful and friendly to each other, which promotes the formation of a caring and upward corporate culture. We have rich technical experience, strong R & D strength and high-quality service team. We always insist on taking science and technology as the productive force, taking quality as the foundation of life, and persisting in relying on the strength of science and technology for continuous development and growth. Our concept is to help presenting the confidence of each buyers with the offering of our most sincere service, and the right product.
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![BLE Low Energy Module]()
BLE Low Energy ModuleZX0802 is a cost-effective Bluetooth SOC Module, and adopt Telink chipset, it supports UART interface to transfer data at pass-through mode, customers can also configure the Bluetooth module -
![Bluetooth Low Energy Mesh Module]()
Bluetooth Low Energy Mesh ModuleZX8258 series is a Bluetooth Low Energy Mesh Module developed by Hangzhou Zhexin Communication Technology Co., LTD. As a low-power Bluetooth transparent transmission module, its application scenarios -
![Wireless Bluetooth Sig Mesh Module]()
Wireless Bluetooth Sig Mesh ModuleZX8258 is a low-power Bluetooth transparent transmission module with Built-in high-performance 32-bit MCU, 512KB Flash and 32/48/64KB SRAM. With Built-in 512K Flash, it supports BLE (Up to Bluetooth -
![Bluetooth Le Mesh Module]()
Bluetooth Le Mesh ModuleZX8258 is a low-power Bluetooth transparent transmission module with Built-in high-performance 32-bit MCU, 512KB Flash and 32/48/64KB SRAM. With Built-in 512K Flash, it supports BLE (Up to Bluetooth -
![Bluetooth Mesh Network Module]()
Bluetooth Mesh Network ModuleZX5005 series is a low-power Bluetooth transparent transmission module launched by Hangzhou Zhexin Communication Technology Co., Ltd. It conforms to the low-power Bluetooth 5.3 specification and can -
![BLE Mesh Module]()
BLE Mesh ModuleAs a BLE Mesh Module, ZX8258 has quite extensive applications. ZX8258 is a low-power Bluetooth transparent transmission module. It is equipped with a high-performance 32-bit MCU, 512KB flash memory -
![Bluetooth Smart BLE Module]()
Bluetooth Smart BLE ModuleZX5005 series is a low-power Bluetooth transparent transmission module launched by Hangzhou Zhexin Communication Technology Co., Ltd. It conforms to the low-power Bluetooth 5.3 specification and can -
![Bluetooth and BLE Module]()
Bluetooth and BLE ModuleZX8271 is a single-mode Bluetooth module with ultra-low power consumption (BLE) using Telink Bluetooth 5.0. The module integrates high-performance RISC 32bit processor, 512KB Flash and 32KB SRAM. -
![BLE 5.3 Module]()
BLE 5.3 ModuleZX8271 is a Telink Bluetooth Module supports peripheral mode and integrates high-performance RISC 32bit processor, 512KB Flash and 32KB SRAM. The module with fully certificates which are widely used -
![BLE Smart Module]()
BLE Smart ModuleZhexin ZX0802 is a Bluetooth V5.3 High-speed serial port transparent transmission module, it supports BLE Slave and OTA upgrade. Main Features Bluetooth 5.2 BLE Proprietary RF SOC UART programming -
![Smallest Bluetooth Chip]()
Smallest Bluetooth ChipZhexin ZX8271 is a Bluetooth V5.0 High-speed serial port transparent transmission module, it supports BLE Slave and OTA upgrade. Main Features Bluetooth 5.0 BLE Proprietary RF SOC UART programming -
![Stack Bluetooth Module]()
Stack Bluetooth ModuleThe Bluetooth low energy chip used by ZX0802 includes a 32-bit MCU, 2.4GHz ISM radio, 128KB Flash and 16KB SRAM, which can provide a maximum power output of 10dBm. The chip's maximum receiving
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We believe that by adhering to a diversified and integrated development model and relying on an excellent corporate culture, we will definitely become a first-class ble quality control module, bluetooth serial hc 06 company. As one of the leading tg113 bluetooth module suppliers in China, we warmly welcome you to buy tg113 bluetooth module made in China here from our factory. All our products are with high quality and low price. For quotation and free sample, contact us now.